•  Shawn
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When Pico-ITX hit the market in mid-2008, many figured that it would be quite some time before we saw a replacement shrink any further. Leave it to the folks at VIA to prove us all wrong. Today, the company is introducing its newest platform, one that's a whopping 50% small than Pico-ITX, which itself is quite a bit smaller than Micro-ITX.

The new platform is called Mobile-ITX, and at 6cm x 6cm, it promises to enable all sorts of next-generation devices. Applications for this mostly live in the medical and military market, but with converged devices shrinking all the time, we suspect it's only a matter of time before this finds use in the commercial world.

Mobile-ITX employs a modularized design that includes a CPU module card and an I/O carrier board, and CPU modules based on the Mobile-ITX form factor integrate core CPU, chipset and memory functionality and I/O that includes the CRT, DVP and TTL display support, HD Audio, IDE, USB 2.0, as well as PCI Express, SMBus, GPIO, LPC, SDIO and PS2 signals, through customizable baseboards. As for power consumption? As little as 5-watts, meaning that these are perfect for always-on scenarios.

VIA Mobile-ITX Brings FurtherMiniaturization and Greater Flexibility to Embedded Devices

Incredibly compact, 6cmx 6cm Mobile-ITX form factor is 50% smaller than Pico-ITX, enablesnext-generation embedded devices

Taipei, Taiwan 1 December 2009 - VIATechnologies, Inc, a leading innovator of power efficient x86 processorplatforms, today announced Mobile-ITX, the latest VIA-developed open formfactor specification for the creation of ultra-compact and portable embeddeddevices. Mobile-ITX defines a uniquely compact 6cm x 6cmcomputer-on-module specification designed to enable an easier and less resourceintensive development cycle for a range of ultra-compact, portable embeddedsystems.

Vertical market segments including medical,transportation and military embedded markets have evolved to demand greaterminiaturization and portability from today’s x86 platforms. Mobile-ITXaddresses the need for a simple, modular approach to portable IPC design,making it easier than ever to bring to market ultra-compact and lightweightdevices that offer comprehensive connectivity options and a rich, flexiblefeature set.

“With Mobile-ITX we have again pushed backthe barriers that limit just how small an embedded industrial PC can be,” saidDaniel Wu, Vice President, VIA Embedded Platform Division, VIA Technologies,Inc. “Mobile-ITX enables the creation of a new breed of ultra-compact, portablenetworked devices suitable for a range of applications, particularly in modernmedical and military segments.”

Mobile-ITX– The Science of Small

Extending VIA’s reputation as a leadinginnovator and creator of ultra-compact form factors, Mobile-ITX at 6cm x 6cm, is currently the most compact computer-on-moduleform factor on the market, an incredible 50% smaller than the successfulVIA-developed Pico-ITX form factor.

Mobile-ITX employs a modularized design thatincludes a CPU module card and an I/O carrier board. This offers greaterflexibility for developers who can simply drop in the CPU module to a customdesigned, application specific carrier board, negating lengthy developmentaldesign and testing phases.

CPU modules based on the Mobile-ITX formfactor integrate core CPU, chipset and memory functionality and I/O thatincludes the CRT, DVP and TTL display support, HD Audio, IDE, USB 2.0, as wellas PCI Express, SMBus, GPIO, LPC, SDIO and PS2 signals, through customizablebaseboards. In keeping with VIA’s signature low power philosophy,Mobile-ITX-based modules consume as little as 5 watts, ideal for always-on,mission critical systems.

This comprehensive range of advancedtechnologies can be implemented on a variety of Mobile-ITX compatible carrierboard designs that can be adapted to suit almost any environment, orapplication specific criteria. The CPU module I/O signals are mapped to twounique high density, low profile connectors on the under side of the module,with a distance between the CPU module and the baseboard of only 3mm, making itideal for ultra-slim system designs. The connectors can also withstandvibrations of up to 5Gs making Mobile-ITX systems suitable for in-vehicle andindustrial machining applications.

More details about the Mobile-ITX formfactor may be found at the VIA website where you can also find a detailed “Mobile-ITXForm Factor” white paper:

For images related to the Mobile-ITX formfactor, please visit:

The VIA Embedded Platform Division willannounce the first commercial CPU module based on the Mobile-ITX form factor inQ1 2010.

AboutVIA Technologies, Inc.

VIA Technologies, Inc is the foremostfabless supplier of power efficient x86 processor platforms that are drivingsystem innovation in the PC, client, ultra mobile and embedded markets.Combining energy-saving processors with digital media chipsets and advancedconnectivity, multimedia and networking silicon enables a broad spectrum ofcomputing and communication platforms, including its widely acclaimed ultracompact mainboards. Headquartered in Taipei, Taiwan, VIA’s global network links the high techcenters of the US, Europeand Asia, and its customer base includes theworld’s top OEMs and system integrators.

  •  3vi1
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Looks about the right size for an x86-based handheld device... but I have to believe that ARM processors would eat it's lunch when it came to performance and power consumption.


I want something that small to run WinXP on as a XIM360 server. Think I could cram it on there?


Mmm. Looks delicious for a storage server!!


Storage handling is what I would want it for.